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First Joint BIS-CEN-CENELEC Workshop organized by the India Task Force
CEN and CENELEC Members have identified India as a key priority market. The objective of CEN and CENELEC is to cooperate more closely with the Bureau of Indian Standards (BIS) and other relevant Indian standardization bodies on various topics of mutual interest, in order to create synergies. As a first step towards creating a close working relationship with BIS and to understand the commonalities and gaps on standardization strategy and the standards development process, a two-day joint workshop was organised by BIS and CEN & CENELEC on 26th and 27th November 2019 in New Delhi, India. The workshop helped identify significant common areas of mutual interest between BIS and CEN & CENELEC, which will be explored further for collaboration between the two regions.
ETSI launches standardized security platform to address IoT, 5G, & security sectors
ETSI TC Smart Card Platform, that standardized the former generations of SIM cards, has been working on a brand-new security platform called Smart Secure Platform (SSP). The ETSI committee has unveiled the first three technical specifications to launch this new security platform.
The ETSI Smart Secure Platform offers an open platform for multiple applications with various physical interfaces and form factors. The new flexible file system and built-in capabilities support several authentication methods, as well as features defined for a UICC - the current security platform used, for instance, for the SIM card - such as a toolkit or a contactless interface. SSP is a highly secure, scalable, thus cost-efficient solution optimized to fit many requirements, from IoT applications to complex solutions, hosting several applications such as banking and payment, ID management and access to mobile networks. Furthermore, the SSP is backwards compatible to the UICC. The three specifications cover the general technical characteristics of the Smart Secure Platform with ETSI TS 103 666?1, the integration of the Secure Element into a System on Chip (SoC) solution in ETSI TS 103 666?2 and, as the first protocol between the Smart Secure Platform and the outside world, the Serial Peripheral Interface (SPI) which is specified in ETSI TS 103 713.
ETSI’s new end-to-end architectural framework for network and service automation
ETSI has announced two major specifications from the ETSI Zero-touch network and Service Management (ZSM) Industry Specification Group. ETSI GS ZSM 001 describes ZSM Requirements and ETSI GS ZSM 002 defines the ZSM Reference Architecture. The glossary of terms and concepts related to ZSM is provided in ETSI GS ZSM 007 that was published along with these specifications.
ETSI GS ZSM 001 examines various business-oriented scenarios and the related automation challenges faced by operators and other industry sectors, and defines the architectural, functional and operational requirements for end-to-end network and service automation. The ZSM architecture specified in ETSI GS ZSM 002 was designed to satisfy these requirements. The architecture is modular, flexible, scalable, extensible and service-based. It is designed for closed-loop automation and optimized for data-driven machine learning and artificial intelligence algorithms.
IIC and oneM2M Joint Whitepaper Enables Digital Transformation
A new joint whitepaper released by The Industrial Internet Consortium® (IIC™) and oneM2M, reveals how developers seeking to reduce complexity when designing Internet of Things (IoT) and Industrial Internet of Things (IIoT) systems, can leverage different architectural approaches side-by-side to enable faster-time-to-market of new Industrial services and use cases. The joint whitepaper, “Advancing the Industrial Internet of Things”, demonstrates how these two leading IoT organizations are working together to advance the IIoT and digital transformation, through the creation of a robust, interoperable, flexible and efficient IIoT ecosystem. Through their work, the IIC and oneM2M aim to help vertical markets achieve interoperability and reusability, by minimizing complexity and the cost of designing, developing and deploying IoT and IIoT systems to shorten time-to-market and value-creation cycles. With a focus on practical deployment tools, the white paper describes how the IIC’s and oneM2M’s architectural approaches can be aligned to provide a toolkit of best practices and technical standards for organizations involved in the design and deployment of IIoT systems.